17 October 2014 Bringing mask repair to the next level
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Abstract
Mask repair is an essential step in the mask manufacturing process as the extension of 193nm technology and the insertion of EUV are drivers for mask complexity and cost. The ability to repair all types of defects on all mask blank materials is crucial for the economic success of a mask shop operation. In the future mask repair is facing several challenges. The mask minimum features sizes are shrinking and require a higher resolution repair tool. At the same time mask blanks with different new mask materials are introduced to optimize optical performance and long term durability. For EUV masks new classes of defects like multilayer and phase defects are entering the stage. In order to achieve a high yield, mask repair has to cover etch and deposition capabilities and must not damage the mask. These challenges require sophisticated technologies to bring mask repair to the next level. For high end masks ion-beam based and e-based repair technologies are the obvious choice when it comes to the repair of small features. Both technologies have their pro and cons. The scope of this paper is to review and compare the performance of ion-beam based mask repair to e-beam based mask repair. We will analyze the limits of both technologies theoretically and experimentally and show mask repair related performance data. Based on this data, we will give an outlook to future mask repair tools.
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K. Edinger, K. Wolff, H. Steigerwald, N. Auth, P. Spies, J. Oster, H. Schneider, M. Budach, T. Hofmann, M. Waiblinger, "Bringing mask repair to the next level", Proc. SPIE 9235, Photomask Technology 2014, 92350R (17 October 2014); doi: 10.1117/12.2072474; https://doi.org/10.1117/12.2072474
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