3 February 2015 Packaging of complete indium-free high reliable and high power diode laser array
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Proceedings Volume 9255, XX International Symposium on High-Power Laser Systems and Applications 2014; 92550X (2015) https://doi.org/10.1117/12.2072357
Event: XX International Symposium on High Power Laser Systems and Applications, 2014, Chengdu, China
Abstract
High power diode lasers have been widely used in many fields. For many applications, a diode laser needs to be robust under on-off power-cycling as well as environmental thermal cycling conditions. To meet the requirements, the conduction cooled single bar CS-packaged diode laser arrays must have high durability to withstand thermal fatigue and long lifetime. In this paper, a complete indium-free bonding technology is presented for packaging high power diode laser arrays. Numerical simulations on the thermal behavior of CS-packaged diode laser array with different packaging structure were conducted and analyzed. Based on the simulation results, the device structure and packaging process of complete indium-free CS-packaged diode laser array were optimized. A series of high power hard solder CS (HCS) diode laser arrays were fabricated and characterized. Under the harsh working condition of 90s on and 30s off, good lifetime was demonstrated on 825nm 60W single bar CS-packaged diode laser with a lifetime test of more than 6100hours achieved so far with less 5% power degradation and less 1.5nm wavelength shift. Additionally, the measurement results indicated that the lower smile of complete indium-free CS-packaged diode laser arrays were achieved by advanced packaging process.
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Jingwei Wang, Xiaoning Li, Feifei Feng, Yalong Liu, Dong Hou, Xingsheng Liu, "Packaging of complete indium-free high reliable and high power diode laser array", Proc. SPIE 9255, XX International Symposium on High-Power Laser Systems and Applications 2014, 92550X (3 February 2015); doi: 10.1117/12.2072357; https://doi.org/10.1117/12.2072357
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