28 July 2014 Front Matter: Volume 9256
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9256, including the Title Page, Copyright information, Table of Contents, Introduction (if any), and Conference Committee listing.

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

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Author(s), “Title of Paper,” in Photomask and Next-Generation Lithography Mask Technology XXI, edited by Kokoro Kato, Proceedings of SPIE Vol. 9256 (SPIE, Bellingham, WA, 2014) Article CID Number.

ISSN: 0277-786X

ISBN: 9781628413236

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Conference Committees

Symposium Chair

  • Toshiyuki Horiuchi, Tokyo Denki University (Japan)

Symposium Vice-chair

  • Masato Shibuya, Tokyo Polytechnic University (Japan)

Advisory Committee Chair

  • Masanori Komuro, New Energy and Industrial Technology Development Organization (Japan)

Advisory Committee

  • Morihisa Hoga, Dai Nippon Printing Company, Ltd. (Japan)

  • Masao Otaki

  • Tadahiro Takigawa

  • Yoshio Tanaka, Luminescent Technologies, Inc. (Japan)

Organizing Committee Chair

  • Toshiyuki Horiuchi, Tokyo Denki University (Japan)

Organizing Committee Vice-chair

  • Masato Shibuya, Tokyo Polytechnic University (Japan)

Organizing Committee

  • Uwe Behringer, UBC Microelectronics (Germany)

  • Parkson Chen, Taiwan Mask Corporation (Taiwan)

  • Han-ku Cho, Samsung Electronics Company, Ltd. (Korea, Republic of)

  • Junko Collins, SEMI Japan (Japan)

  • Brian J. Grenon, Advanced Technical Instruments (United States)

  • Takehiko Gunji, Sony Corporation (Japan)

  • Hideaki Hamada, HTL Company Japan Ltd. (Japan)

  • Naoya Hayashi, Dai Nippon Printing Company, Ltd. (Japan)

  • Eiichi Hoshino, Nikon Corporation (Japan)

  • Kunihiro Hosono, Renesas Electronics Corporation (Japan)

  • Kokoro Kato, Hitachi High-Tech Science Corporation (Japan)

  • Hideaki Mitsui, HOYA Corporation (Japan)

  • Warren Montgomery, CNSE (United States)

  • Ichiro Mori, EUVL Infrastructure Development Center, Inc. (Japan)

  • Hiroaki Morimoto, Toppan Printing Company, Ltd. (Japan)

  • Yoshiki Suzuki, KLA-Tencor Japan Ltd. (Japan)

  • Yoji Tonooka, Toppan Printing Company, Ltd. (Japan)

  • Koichiro Tsujita, Canon Inc. (Japan)

  • Anto Yasaka, Hitachi High-Tech Science Corporation (Japan)

Steering Committee Chair

  • Hiroaki Morimoto, Toppan Printing Company, Ltd. (Japan)

Steering Committee Vice-chairs

  • Kunihiro Hosono, Renesas Electronics Corporation (Japan)

  • Hidehiro Watanabe, EUVL Infrastructure Development Center, Inc. (Japan)

Steering Committee

  • Takayuki Abe, NuFlare Technology Inc. (Japan)

  • Akihiko Ando, Renesas Electronics Corporation (Japan)

  • Kazuko Jochi, KLA-Tencor Japan Ltd. (Japan)

  • Takashi Kamo, Toshiba Corporation Corporate Research and Development Center (Japan)

  • Kokoro Kato, Hitachi High-Tech Science Corporation (Japan)

  • Yasutaka Morikawa, Dai Nippon Printing Company, Ltd. (Japan)

  • Teruaki Noguchi, JEOL Ltd. (Japan)

  • Yasushi Ohkubo, HOYA Corporation (Japan)

  • Tomoyuki Okada, Fujitsu Semiconductor Ltd. (Japan)

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

  • Hiroyoshi Tanabe, Intel K.K. (Japan)

  • Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)

Program Committee Chair

  • Kokoro Kato, Hitachi High-Tech Science Corporation (Japan)

Program Committee Vice-chairs

  • Akihiko Ando, Renesas Electronics Corporation (Japan)

  • Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)

Program Committee

  • Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan)

  • Jeff Farnsworth, Intel Corporation Technology and Manufacturing Group (United States)

  • Thomas B. Faure, IBM Corporation (United States)

  • Kazuyuki Hagiwara, D2S, K.K. (Japan)

  • Shigeru Hirukawa, Nikon Corporation (Japan)

  • Koji Hosono, Fujitsu Semiconductor Ltd. (Japan)

  • Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan)

  • Ichiro Kagami, Sony Semiconductor Corporation (Japan)

  • Franklin Kalk, Toppan Photomasks, Inc. (United States)

  • Byung-Gook Kim, Samsung Electronics Company, Ltd. (Korea, Republic of)

  • Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)

  • Jun Kotani, Toppan Printing Company, Ltd. (Japan)

  • John Lin, Taiwan Semiconductor Manufacturing Company (Taiwan)

  • Mark Ma, Photronics, Inc. (United States)

  • Junji Miyazaki, ASML Japan Company, Ltd. (Japan)

  • Koji Murano, TOSHIBA Corporation (Japan)

  • Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan)

  • Yasutoshi Nakagawa, JEOL Ltd. (Japan)

  • Noriaki Nakayamada, NuFlare Technology Inc. (Japan)

  • Naoki Nishida, HOYA Corporation (Japan)

  • Yuji Nonami, Panasonic Corporation (Japan)

  • Steffen Schulze, Mentor Graphics Corporation (United States)

  • Yasunari Sohda, Hitachi, Ltd. (Japan)

  • Osamu Suga, EUVL Infrastructure Development Center, Inc. (Japan)

  • Yasuko Tabata, TowerJazz Panasonic Semiconductor, Ltd. (Japan)

  • Yoji Takagi, Applied Materials Japan, Inc. (Japan)

  • Kiwamu Takehisa, Lasertec Corporation (Japan)

  • Richard Tseng, Taiwan Mask Corporation (Taiwan)

  • Yoichi Usui, HOYA Corporation (Japan)

  • Nobuhiko Yabu, Canon Inc. (Japan)

  • Tetsuya Yamamoto, KLA-Tencor Corporation (United States)

Session Chairs

  • 1 Opening Session

    Kokoro Kato, Hitachi High-Tech Science Corporation (Japan)

  • 2 Inspection and Cleaning

    Akihiko Ando, Renesas Electronics Corporation (Japan)

    Hidemichi Imai, Dai Nippon Printing Company, Ltd. (Japan)

  • 3 NIL

    Jun Kotani, Toppan Printing Company, Ltd. (Japan)

  • 4 Writing Technologies

    Uwe Behringer, UBC Microelectronics (Germany)

    Noriaki Nakayamada, NuFlare Technology, Inc. (Japan)

  • 5 Lithography Related Technologies

    Nobuyuki Yoshioka, Dai Nippon Printing Company, Ltd. (Japan)

  • 6 FPD Masks

    Ichiro Kagami, Sony Semiconductor Corporation (Japan)

    Nobuhiko Yabu, Canon Inc. (Japan)

  • 8 Invited Session

    Thomas Faure, IBM Corporation (United States)

    Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan)

  • 9 Metrology

    Thomas Faure, IBM Corporation (USA)

    Yoshinori Nagaoka, KLA-Tencor Japan Ltd. (Japan)

  • 10 EUVL Masks I

    Natalia Davydova, ASML Netherlands B. V. (The Netherlands)

    Tsukasa Abe, Dai Nippon Printing Company, Ltd. (Japan)

  • 11 EUVL Masks II

    Jeff Farnsworth, Intel Corporation (United States)

    Koji Murano, Toshiba Corporation (Japan)

  • 12 EUVL Masks III

    Byung-Gook Kim, Samsung Electronics (Korea, Republic of)

    Yutaka Kodera, Toppan Printing Company, Ltd. (Japan)

© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 9256", Proc. SPIE 9256, Photomask and Next-Generation Lithography Mask Technology XXI, 925601 (28 July 2014); doi: 10.1117/12.2074854; https://doi.org/10.1117/12.2074854
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