Pre-layout AC decoupling analysis with Mentor Graphics HyperLynx

Mihaela Hnatiuc; Cătălin J. Iov

doi:10.1117/12.2070349

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20 February 2015 Pre-layout AC decoupling analysis with Mentor Graphics HyperLynx

Mihaela Hnatiuc; Cătălin J. Iov

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Proceedings Volume 9258, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VII; 92582I (2015) https://doi.org/10.1117/12.2070349
Event: Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies 2014, 2014, Constanta, Romania

Abstract

Considerable resources have been used since the humans got interested to discover the world around. Any discovery and science advance was taken tremendously amount of time, money, sometimes lives. All of these define the cost of a discovery, developing process. Getting back to electronics, this field faced in the last 20-30 years, a big boom in terms of technologies and opportunities. Thousands of equipment were developed and placed on the market. The big difference between various competitors is made at the moment by that we call the time to market. A mobile, for instance, has a time to market of around 6 months and the tendency is to have it smaller than that. That means between the concept and the first model sale, no more than 6 months should be passing. That is why new approaches are needed. The one extensively used now is the simulation. We call the simulation virtual prototyping. The virtual prototyping takes into account more than the components only. It takes into account some other project parameters that would affect the final product. Certified tools can handle such analysis. In our paper we present the case of HyperLynx, a concept developed by Mentor Graphics Company, assisting the hardware designer throughout the designing process, from thermal point of view. A test case board was analyzed at the pre-layout stage and the results presented.

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Mihaela Hnatiuc and Cătălin J. Iov "Pre-layout AC decoupling analysis with Mentor Graphics HyperLynx", Proc. SPIE 9258, Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies VII, 92582I (20 February 2015); https://doi.org/10.1117/12.2070349

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