Numerical analysis of thermal effects in semiconductor disk laser with water cooling

Renjiang Zhu; Yingjun Pan; Maohua Jiang; Peng Zhang

doi:10.1117/12.2071223

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18 November 2014 Numerical analysis of thermal effects in semiconductor disk laser with water cooling

Renjiang Zhu, Yingjun Pan, Maohua Jiang, Peng Zhang

Proceedings Volume 9267, Semiconductor Lasers and Applications VI; 92670X (2014) https://doi.org/10.1117/12.2071223
Event: SPIE/COS Photonics Asia, 2014, Beijing, China

Abstract

This paper has established a thermal model of Vertical-external-cavity surface-emitting semiconductor laser (VECSELs) with water-cooled heatsink, calculated the distribution of temperature field with finite element method, and studied the effects of pumping light, heat transfer coefficient, and heatsink characteristics on the maximum temperature of the quantum well. Calculations show that there is an optimal heat transfer coefficient value interval, thermal conductivity of the VECSELs heatsink will have a significant impact on the maximum temperature of the quantum well, and increasing area of cooler heatsink would help to improve heat dissipation performance. It also shows that the maximum temperature of the quantum well has a linear relationship with pump power, and a nearly inverse relationship with the spot size. Due to thermal diffusion of water-cooled heatsink for VECSELs point heat source, the maximum temperature of quantum well is not sensitive to thickness and area of the heatsink, heat dissipation performance which uses a diamond heatsink is about 1.7 times the oxygen-free copper heatsink.

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Renjiang Zhu, Yingjun Pan, Maohua Jiang, and Peng Zhang "Numerical analysis of thermal effects in semiconductor disk laser with water cooling", Proc. SPIE 9267, Semiconductor Lasers and Applications VI, 92670X (18 November 2014); https://doi.org/10.1117/12.2071223

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