20 August 2014 Simulation research on cutting brittle optical material with diamond wire saw based on LS-DYNA
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Proceedings Volume 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 92811A (2014) https://doi.org/10.1117/12.2069794
Event: 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), 2014, Harbin, China
Abstract
The quality of optical material cutting affects the efficiency and quality of follow-up polishing processing directly. Among various ways of cutting, the diamond wire saw cutting of fixed abrasive has advantages of narrow cutting seam, efficient cutting, high chip quality, little pollution to environment, ability to process bigger diameter workpiece, etc. So it has been used widely in optical material processing. In this paper, the coupled algorithm of FEM/SPH has been used to simulate deformation, fracture of brittle optical material in diamond grain cutting. The influence of workpiece feeding rate, cutting speed and cutting depth on the surface roughness are then analyzed in detail. Numerical simulation results show that the coupled algorithm efficiently explains the mechanism of material removal. From these results, we can not only determine optimum technology parameters for the manufacture of diamond wire saw, but also provide basis for improving the wire cutting efficiency and finished-product rate of optical material.
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Jian Wang, Jian Wang, Jianbo Liu, Jianbo Liu, Yonghao Xiao, Yonghao Xiao, Shicao Zhao, Shicao Zhao, } "Simulation research on cutting brittle optical material with diamond wire saw based on LS-DYNA", Proc. SPIE 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 92811A (20 August 2014); doi: 10.1117/12.2069794; https://doi.org/10.1117/12.2069794
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