6 August 2014 Simulation analysis of grinding wheel motion trajectory on SiC ceramics aspheric surface grinding
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Proceedings Volume 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies; 92811N (2014) https://doi.org/10.1117/12.2070052
Event: 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2014), 2014, Harbin, China
Abstract
In grinding process of SiC ceramics aspheric surface, the motion trajectory of grinding wheel has great influence on the surface forming. The paper provides mathematical models of grinding wheel movements; analytical simulation was done to describe the trajectories of the grinding wheel in manufacturing an aspherical workpiece. The effect of grinding parameters (including the rotation speed of the workpiece, the feed rate of grinding wheel etc.) on the aspheric surface coverage rate was conducted and discussed in detail. An experimental study was done according to the simulation results and an aspheric surface with form error less than 10μm was gained.
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Feihu Zhang, Feihu Zhang, Lifei Liu, Lifei Liu, Chunhui Li, Chunhui Li, } "Simulation analysis of grinding wheel motion trajectory on SiC ceramics aspheric surface grinding ", Proc. SPIE 9281, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Advanced Optical Manufacturing Technologies, 92811N (6 August 2014); doi: 10.1117/12.2070052; https://doi.org/10.1117/12.2070052
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