You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
18 September 2014High-accuracy inspection of defects and profile of wafers by phase measuring deflectometry
The demands of the less-defective and high-flatness wafers are urgent in many wafer based technologies ranging from micro-electronics to the current photovoltaic industry. As the wafer becomes thinner and larger to cope with the advances in those industries, there is an increasing possibility of the emerging of crack and warp on the wafer surface. High-accuracy inspection of defects and profile are thus necessary to ensure the reliability of device. Phase measuring deflectometry(PMD) is a fast, cost-effective and high accuracy measurement technology which has been developed in recent years. As a slope measurement technology, PMD possesses a high sensitivity. Very small slope variation will lead to a large variation of the phase. PMD is very possible to have a good performance in the wafer inspection. In this paper, the requirements of the wafer inspection in the industries are discussed, and compatibility of PMD and those requirements is analyzed. In the experimental work, PMD gets the slope information of the wafer surface directly. The curvature or height information can be acquired simply by the derivation or integral of the slope. PMD is proved to make a superior result in high-precision defect detecting and shape measurement of wafer by the analysis of experiment results.
Huimin Yue,Yuxiang Wu,Biyu Zhao,Zhonghua Ou, andYong Liu
"High-accuracy inspection of defects and profile of wafers by phase measuring deflectometry", Proc. SPIE 9282, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 928208 (18 September 2014); https://doi.org/10.1117/12.2067887
The alert did not successfully save. Please try again later.
Huimin Yue, Yuxiang Wu, Biyu Zhao, Zhonghua Ou, Yong Liu, "High-accuracy inspection of defects and profile of wafers by phase measuring deflectometry," Proc. SPIE 9282, 7th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment, 928208 (18 September 2014); https://doi.org/10.1117/12.2067887