25 September 2014 Impact of hot temperature on end-face geometry of LC/UPC connectors
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Proceedings Volume 9288, Photonics North 2014; 92880A (2014) https://doi.org/10.1117/12.2075190
Event: Photonics North 2014, 2014, Montréal, Canada
Abstract
The fiber withdrawal of Group 4 (mated-thermal cycle) was observed up to 100 nm as in previous work1. We predict that this withdrawal is mainly caused by the impact of hot temperature (at 75ºC) based on GR-3262 thermal cycle test profile repeated 21 cycles over 7 days; and thus, it was studies here for the purpose of reducing test time. All connectors were separated into four groups: 1) unmated-stored at room temperature, 2) mated-stored at room temperature, 3) unmated-stored at hot temperature, and 4) mated-stored at hot temperature. The hot temperature test was performed on Groups 3 and 4 for 1 hour, while Groups 1 and 2 was left at room temperature. The sample size of each group is 28 LC/UPC connectors. Radius of curvature, fiber height and apex offset were measured before and after that 1 hour. The fiber withdrawal up to 100 nm is found in Group 4 (mated-hot temperature), but no changes are observed in Groups 1-3. These results confirm the impact of hot temperature on fiber height, same as the thermal cycle test in previous work1. Afterward, Group 1-4 were unmated at room temperature for 1 day, 1 week, and 1 month. No significant change in fiber height is found. On the contrary, when Group 1-4 were re-tested as being mated at hot temperature for 1 hour, the fiber withdrawal up to 100 nm is now found in Group 1-3. However, the additional withdrawal up to 50 nm is still observed in Group 4.
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Rutsuda Thongdaeng, Duangrudee Worasucheepb, Sathit Wangsan, Wansan Chaichok, "Impact of hot temperature on end-face geometry of LC/UPC connectors", Proc. SPIE 9288, Photonics North 2014, 92880A (25 September 2014); doi: 10.1117/12.2075190; https://doi.org/10.1117/12.2075190
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