18 December 2014 Research on the thermal effect of copper between adjacent pulses under moving laser irradiation
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Abstract
The research focused on the effect of the change in distance between adjacent centers and the size of the laser spots on the material temperature field. Aiming at the parameter optimization of pulse laser machining copper, the moving focus model based on heat conduction equation was introduced. And the finite element analysis software, COMSOL Multiphysics, was also utilized in the research. Without considering the phase transition process of copper, the results of the numerical simulation was shown in this paper. By the simulation study of copper’s irradiation with two adjacent pulses, the effect of the change in distance between adjacent centers and the size of the laser spots on the temperature field of the copper and the quantized results under the specific laser spot conditions were obtained simultaneously. Based on the results, several conclusions could be reached, when the laser spot size was small or the distance between adjacent centers is large, the mutual effect of the adjacent pulses could be ignored. When the spot size increased or the distance between adjacent centers decreased, the mutual effect got obviously. And the conclusions could be applied on the field of laser drilling, laser welding, etc. The former pulse’s temperature field was mainly used to increase the initial temperature of the later pulse’s affecting field, while the influence from the later pulse to the former one was slowing down the temperature decrease and reheating.
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Boshi Yuan, Guangyong Jin, Di Wang, Zhi Wei, HuaDong Yu, "Research on the thermal effect of copper between adjacent pulses under moving laser irradiation", Proc. SPIE 9295, International Symposium on Optoelectronic Technology and Application 2014: Laser Materials Processing; and Micro/Nano Technologies, 92950M (18 December 2014); doi: 10.1117/12.2072862; https://doi.org/10.1117/12.2072862
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