20 November 2014 Super-framing technique based on digital readout for infrared thermal image systems
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Proceedings Volume 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications; 930003 (2014) https://doi.org/10.1117/12.2072139
Event: International Symposium on Optoelectronic Technology and Application 2014, 2014, Beijing, China
Abstract
Photo current integration is the key to improve the performance of a thermal imaging system. By integrating the photo current in the capacitance, the signal-to-noise ratio of the system is greatly improved. Theoretically, the maximum integration time of a thermal imaging system is the frame time of the system. However, due to the low well capacity of the readout integrated circuit, the integration time of the photo current is often shorter than the frame time of the system. To increase the well capacity of the readout circuit is one of the main research topics in thermal imaging system. The super-framing technique can overcome the restriction by reading-out the detector signal in a rate higher than the frame rate and then integrating the signal outside the IRFPA. As the signal integration is carried out outside the pixel, the integration time is no longer restricted. The key of the super-framing technique is the transmission of the signal in high readout rate. The digital readout circuit by integrating the analog-to-digital converter (ADC) array on the readout circuit chip becomes more and more popular with the development of CMOS technologies. Since the digital signal can be transferred outside the chip in a GS/s rate without any concern on noise and distortion, the super-framing technique based on digital readout circuit is advantageous over the analog solution.
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Libin Yao, Libin Yao, } "Super-framing technique based on digital readout for infrared thermal image systems ", Proc. SPIE 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications, 930003 (20 November 2014); doi: 10.1117/12.2072139; https://doi.org/10.1117/12.2072139
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