20 November 2014 Optimization of indium bump preparation in infrared focal plane array fabrication
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Proceedings Volume 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications; 93000U (2014) https://doi.org/10.1117/12.2071086
Event: International Symposium on Optoelectronic Technology and Application 2014, 2014, Beijing, China
Abstract
Optimization of indium bump preparation in infrared focal plane array (IRFPA) fabrication is presented. Reasons of bringing defective pixels during conventional lift-off and cleanout process in fabrication of indium bump are discussed. IRFPAs are characterized by IRFPA test-bench. Results show that defective pixels of InSb IRFPA are owing to indium bumps connecting through indium residue on the surface of wafer. The characteristic and configuration of defective pixels of InSb IRFPA are given and analyzed. A method of reducing defective pixels through optimizing liftoff and cleanout process in InSb IRFPA is proposed. Results prove that this method is effective.
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Zhijin Hou, Zhijin Hou, Junjie Si, Junjie Si, Wei Wang, Wei Wang, Haizhen Wang, Haizhen Wang, Liwen Wang, Liwen Wang, "Optimization of indium bump preparation in infrared focal plane array fabrication", Proc. SPIE 9300, International Symposium on Optoelectronic Technology and Application 2014: Infrared Technology and Applications, 93000U (20 November 2014); doi: 10.1117/12.2071086; https://doi.org/10.1117/12.2071086
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