4 March 2015 J-integral evaluation for an interface crack under thermal load using digital image correlation
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Proceedings Volume 9302, International Conference on Experimental Mechanics 2014; 93022G (2015) https://doi.org/10.1117/12.2076716
Event: International Conference on Experimental Mechanics 2014, 2014, Singapore, Singapore
Abstract
In this study, a method for evaluating a fracture parameter, J-integral, for an interface crack from the displacement fields under thermal deformation is developed for studying the fracture behavior of an interface crack in an actual electronic component. First, the displacement fields around an interface crack tip are measured using digital image correlation (DIC). Second, the displacement gradient and strain are determined from the displacement fields using a finite element smoothing technique on the domain of integration. Then, the stress components are determined from the strains using the elastic-plastic relations with the incremental strain theory and the each material property. Finally, the J-integral value is determined by the numerical integration on the domain of integration. The effectiveness of this evaluation method is demonstrated by applying this method to the displacement fields obtained from the elastic-plastic finite element analysis.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Hiroto Yamane, Hiroto Yamane, Shuichi Arikawa, Shuichi Arikawa, Satoru Yoneyama, Satoru Yoneyama, Yasuaki Watanabe, Yasuaki Watanabe, Tatsuhiko Asai, Tatsuhiko Asai, Kunio Shiokawa, Kunio Shiokawa, } "J-integral evaluation for an interface crack under thermal load using digital image correlation", Proc. SPIE 9302, International Conference on Experimental Mechanics 2014, 93022G (4 March 2015); doi: 10.1117/12.2076716; https://doi.org/10.1117/12.2076716
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