3 March 2015 Hybrid silicon unidirectional-emission microspiral disk lasers for optical interconnect applications
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Abstract
In this paper, we report our recent progress on hybrid silicon uniport-waveguide-emission microspiral disk lasers for optical interconnects using bisbenzocyclobutene (BCB) die-to-die bonding. We numerically and experimentally investigate different silicon microspiral disk cavities directly coupled with an output-waveguide, with III-V multiple-quantum-well (MQW) gain mediums of different circular microdisk geometries vertically coupled on the top via a sub- 100nm BCB layer, and ring-shaped injection electrodes along the rim of the hybrid integrated structure in order to enhance the spatial overlap between the injection current distribution in the III-V gain microdisk and the whispering-gallery-like mode field in the hybrid silicon microcavity. We design and experimentally investigate an integrated thermal shunt connecting a 90o-arc of the III-V gain microdisk to the silicon substrate underneath in order to lower the thermal resistance of the lasers. We observe transverse-electric (TE)-polarized mode dominated multimode lasing emission out-coupled from the silicon waveguide of the hybrid silicon lasers under a pulsed injection at room temperature, with a threshold current of 30 mA and a side-mode-suppression-ratio (SMSR) of 25 dB at 50 mA.
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Andrew W. Poon, Andrew W. Poon, Yu Zhang, Yu Zhang, Lei Zhang, Lei Zhang, "Hybrid silicon unidirectional-emission microspiral disk lasers for optical interconnect applications", Proc. SPIE 9343, Laser Resonators, Microresonators, and Beam Control XVII, 934312 (3 March 2015); doi: 10.1117/12.2084810; https://doi.org/10.1117/12.2084810
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