9–12 February 2015

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Volume 9346

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

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Author(s), “Title of Paper,” in Components and Packaging for Laser Systems, edited by Alexei L. Glebov, Paul O. Leisher, Proceedings of SPIE Vol. 9346 (SPIE, Bellingham, WA, 2015) Article CID Number.

ISSN: 0277-786X

ISBN: 9781628414363

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Authors

Numbers in the index correspond to the last two digits of the six-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first four digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Anoikin, Eugene, 0T

Asoubar, Daniel, 0N

Avila, Marco A., 0J

Bartelt, H., 0W

Baskin, Ilya, 03

Benabid, F., 0Z

Bennett, Andrew, 0T

Berk, Yuri, 03

Bernhardt, Henning, 0K

Bradshaw, H. N., 0H

Brecher, Christian, 0E, 0I, 0K

Buchwald, Kristian, 0V

Cai, Lei, 04

Chen, Jian, 0X

Chu, Hong, 0V

Cook, W. B., 0H

Cui, Long, 1A

Czernecki, Robert, 19

Dahan, Nir, 03

Dai, Ye, 04

de Vries, O., 0W

de Wit, Henk, 0T

Debord, B., 0Z

Deneuville, Francois, 11

Denny, Z. H., 0H

Diebold, A., 0Z

Divliansky, Ivan, 0Q

Dong, Jingtao, 0X

Eberhardt, Ramona, 0U, 0W

Emaury, F., 0Z

Eschrich, T., 0W

Feng, Feifei, 05, 0C

Fidler, Franz, 19

Forrer, H., 02

Forrer, M., 02

Fritsche, Haro, 14

Gérôme, F., 0Z

Glebov, Leonid B., 0Q

Gries, Wolfgang, 14

Grohe, Andreas, 14

Haag, Sebastian, 0E, 0I, 0K

Hagen, Thomas, 14

Hale, Evan, 0Q

Hambeck, Christian, 19

Haverkamp, Tobias, 0K

Hou, Dong, 04, 05, 07

Huber, M., 02

Hülsewede, Ralf, 08

Hults, J. A., 0H

Jäger, M., 0W

Ji, Yiqin, 0X

Jundt, Dieter H., 0M

Juzumas, Valdemaras, 15

Keller, U., 0Z

Kern, Holger, 14

Kindsvater, Alex, 08

Kitzmantel, M., 06

Klenke, Arno, 0U

Klumel, Genady, 03

Kobelke, J., 0W

Koch, Ralf, 14

Kotnur Venu, Vyshak, 0E

Kruschke, Bastian, 14

Kura, D., 02

Landles, Kennedy, 19

Laskin, Alexander, 0R, 15

Laskin, Vadim, 0R, 15

Legg, Thomas H., 0O

Levy, Moshe, 03

Li, Xiaoning, 05, 07, 0C

Li, Yingjie, 04

Limpert, Jens, 0U

Liu, Huasong, 0X

Liu, Hui, 1A

Liu, Xingsheng, 04, 05, 07, 0C, 1A

Liu, Yalong, 05, 0C

Losch, Daniel, 0I

MacKay, Peter E., 0M

McDougall, Stewart D., 19

Meredith, Wyn, 19

Meusel, Jens, 08

Moser, H., 02

Mourad, S., 02

Muhr, Alexander, 0T

Müller, Tobias, 0E, 0K

Najda, Stephen, 19

Neubauer, E., 06

Ostrun, Aleksei, 0R, 15

Ott, Daniel, 0Q

Otto, Michael, 0F

Pahl, Ulrich, 14

Peleg, Ophir, 03

Perlin, Piotr, 19

Peschel, Thomas, 0U

Pietrzak, Agnieszka, 08

Plötner, M., 0W

Ramos-Izquierdo, L. A., 0H

Rappaport, Noam, 03

Reitterer, Jörg, 19

Ropert, Laurent, 11

Roßmann, Jürgen, 0I

Rothhardt, Carolin, 0U

Rothhardt, Jan, 0U

Rübenach, Olaf, 0K

Saint Julien-Wallsee, Ferdinand, 19

Saleh, Bahaa E. A., 0Q

Saraceno, C. J., 0Z

Sauer, Sebastian, 0E

Sauvageot, Paul, 11

Schlette, Christian, 0I

Schmid, Ulrich, 19

Schmidlin, M., 02

Schreiber, T., 0W

Schriber, C., 0Z

Sebastian, Jürgen, 08

SeGall, Marc, 0Q

Shamay, Moshe, 03

Shardlow, Peter, 0O

Šlekys, Gintas, 15

Smith, K. A., 0H

Stanczyk, Szymon, 19

Stevens, Gary, 0O

Südmeyer, T., 0Z

Tarasov, Aleksandr A., 0V

Theis, Sébastien, 11

Troupaki, E., 0H

Tünnermann, Andreas, 0U, 0W

Twitchen, Daniel, 0T

Unger, S., 0W

Urniežius, Aivaras, 15

Vickers, Garrie, 19

Wang, Jingwei, 04, 05, 07, 0C

Wang, Zongzhao, 16

Wenzel, Christian, 0E

Wölz, Martin, 08

Wu, Di, 1A

Wu, S., 0H

Wu, Zhouling, 0X

Wyrowski, Frank, 0N, 16

Xiong, Lingling, 07

Yanson, Dan, 03

Yu, Dongshan, 0C

Yuan, Zhiyuan, 1A

Zeldovich, Boris Y., 0Q

Zhang, Pu, 04, 07, 0C

Zhang, Site, 0N, 16

Zontar, Daniel, 0E, 0I, 0K

Zorn, Martin, 08

Conference Committee

Symposium Chairs

Guido Hennig, Daetwyler Graphics AG (Swtizerland) Yongfeng Lu, University of Nebraska-Lincoln (United States)

Symposium Co-chairs

Bo Gu, Bos Photonics (United States)

Andreas Tünnermann, Fraunhofer-Institut für Angewandte Optik und Feinmechanik (Germany) and Friedrich-Schiller-Universität Jena (Germany)

Program Track Chair

Gregory J. Quarles, Optoelectronics Management Network (United States)

Conference Chairs

Alexei L. Glebov, OptiGrate Corporation (United States)

Paul O. Leisher, Rose-Hulman Institute of Technology (United States)

Conference Program Committee

Igor Anisimov, Air Force Research Laboratory (United States)

Kristian J. Buchwald, Ibsen Photonics A/S (Denmark)

Te-Yuan Chung, National Central University (Taiwan)

Joseph L. Dallas, Avo Photonics, Inc. (United States)

Martin Forrer, FISBA OPTIK AG (Switzerland)

Daniel M. Grasso, Coherent, Inc. (United States)

Michael A. Karavitis, Cutera, Inc. (United States)

Alexander V. Laskin, AdlOptica Optical Systems GmbH (Germany)

Victor Liu, Xi’an Focuslight Technologies Co., Ltd. (China)

Jens Meinschien, LIMO Lissotschenko Mikrooptik GmbH (Germany)

Christian V. Poulsen, NKT Photonics Inc. (United States)

Mark A. Stephen, NASA Goddard Space Flight Center (United States)

Takunori Taira, Institute for Molecular Science (Japan)

Torsten Vahrenkamp, ficonTEC Service GmbH (Germany)

Alexander Yusim, IPG Photonics Corporation (United States)

Arnaud Zoubir, ALPhANOV (France)

Session Chairs

1 Laser Diode Packaging and Components: Joint Session with Conferences 9346 and 9348

Paul O. Leisher, Rose-Hulman Institute of Technology (United States) Kurt J. Linden, N2 Biomedical (United States)

2 LD Components and Packaging I

Joseph Louis Dallas, Avo Photonics, Inc. (United States)

3 LD Components and Packaging II

Jingwei Wang, Xi’an Focuslight Technologies Co., Ltd. (China)

4 Optics Assembly and Reliability I

Torsten Vahrenkamp, ficonTEC Service GmbH (Germany)

5 Optics Assembly and Reliability II

Martin Forrer, FISBA OPTIK AG (Switzerland)

6 Solid-State and Fiber Laser Components

Alexander Yusim, IPG Photonics Corporation (United States)

7 Beam Manipulation and Delivery

Te-Yuan Chung, National Central University (Taiwan)

8 High Power/Energy Laser Components

Thomas Mitra, LIMO Lissotschenko Mikrooptik GmbH (Germany)

9 Components for Ultra-Short Pulse Lasers

Christian V. Poulsen, NKT Photonics Inc. (United States)

10 Beam Combining Techniques

Alexei L. Glebov, OptiGrate Corporation (United States)

Introduction

Optical components are crucial for laser performance and form a foundation for advances in laser science and technology. All around the globe, vast and constantly growing research efforts are dedicated to developing new and more advanced laser components and systems. Along this line, packaging solutions for optical components enable their most efficient and consistent integration in laser systems. Laser component packaging is decisive for stable and reliable laser operations while not only improving laser characteristics but also enabling broader laser usability and applications.

Cross-listed between the LASE and OPTO symposia of SPIE Photonics West, the Components and Packaging for Laser Systems conference is primarily focused on achievements and progress made in the field of optical components and packaging technology for laser systems such as semiconductor lasers, solid state lasers, fiber lasers, gas lasers, continuous-wave and pulsed lasers, ultra-short pulsed lasers, and others. Examples of optical components for lasers include macro- and micro-optic lenses and arrays, diffractive and holographic elements, coating technology, polarization optics, fiber optic connectors, couplers, splitters, and isolators, laser gain media, beam transformation systems, components for ultra-short pulsed lasers, components for coherent and spectral beam combining, mid-IR elements, novel design methodologies, and advanced manufacturing techniques. Examples of packaging technology include assembly and mounting solutions of optical components, thermal management and packaging approaches in high-power lasers, laser array packaging and lensing, novel active and passive alignment techniques, laser system reliability, and package modelling.

This conference was created to address a gap in the technical program at Photonics West. Specifically, the developers working on component and packaging technologies (especially those common to several classes of laser systems) did not have a dedicated venue where they could present to their colleagues, customers, and suppliers. Prior to the creation of this conference, such talks would either be relegated to conferences specific to one laser system class, or more commonly, not be presented at all. In this inaugural year, our strong international committee comprising engineers and scientists from academia and industry did an outstanding job of building up and promoting this new conference, as evidenced by the large number of high quality papers we received. We were also delighted to see very strong attendance of the presentations throughout the week, and before an overflow room was designated, almost all seats were filled with many standees backed up into the hallway.

In closing, we are very thankful to the committee, authors, and attendees who made this year such a great success and we are looking forward to an even better conference next year.

Alexei L. Glebov

Paul O. Leisher