12 March 2015 Ultrafast laser processing and metrology for consumer applications
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High-intensity, blue LEDs have attracted interest because of their wide applications. Dicing method using tightly focused ultra-fast laser beam inside the sapphire substrate is one of the remarkable processing method in terms of high yield and LED performance. In this paper, we would like to introduce the polarization controlled laser processing technique in which laser beam is focused tightly inside the sapphire substrate. The morphology of a cut line can be controlled by changing the direction of laser polarization to an orientation at of the substrate. We, moreover, found that the crack inside the sapphire substrate can be elongated by using the double pulse train for 20 % larger than the single pulse when the pulse interval was 20 nsec. The crack was fabricated effectively by shorter pulse interval.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Naoki Murazawa, Naoki Murazawa, Kunimitsu Takahashi, Kunimitsu Takahashi, "Ultrafast laser processing and metrology for consumer applications", Proc. SPIE 9351, Laser-based Micro- and Nanoprocessing IX, 935118 (12 March 2015); doi: 10.1117/12.2086715; https://doi.org/10.1117/12.2086715


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