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16 March 2015 Understanding degradation phenomena in organic electronic devices
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This study addresses a unique degradation mechanism in organic electronic devices occurring due to combined effects of electric field and temperature. A simple polymer diode structure consisting of a semiconducting polymer sandwiched between two electrodes (ITO and Al) is considered for degradation studies. It is observed that voltages beyond a certain value lead to fracture of polymer and aluminium films. As characterized, these defects show that the degradation nucleates in the form of a chain-like pattern consisting of alternating polymer fracture sites (hinges) and aluminium rupture sites (links). A mechanism is hypothesized based on experimental observations to explain the phenomenon. This is further validated by an analytical model for stress at degradation sites due to electric field and temperature. The model is used to develop a failure criteria based on device geometry, operating voltage and temperature. Experiments and modelling predict that this mechanism might be unique to soft thin film electronic devices.
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Jagdish A.K., G. Pavan Kumar, Praveen C. Ramamurthy, D. Roy Mahapatra, and Gopalkrishna Hegde "Understanding degradation phenomena in organic electronic devices", Proc. SPIE 9360, Organic Photonic Materials and Devices XVII, 93600S (16 March 2015);

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