Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing

S. J. Ben Yoo

doi:10.1117/12.2085593

27 February 2015 Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing

S. J. Ben Yoo

Proceedings Volume 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII; 93660B (2015) https://doi.org/10.1117/12.2085593
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

This paper discusses heterogeneous 2D and 3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems information processing capabilities in the temporal, spectral, and spatial domains. Future prospects and challenges in computing and networking applications will also be discussed.

Citation Download Citation

S. J. Ben Yoo "Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660B (27 February 2015); https://doi.org/10.1117/12.2085593

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