27 February 2015 Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing
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Abstract
This paper discusses heterogeneous 2D and 3D photonic integration technologies involving various novel fabrication techniques leading to realization of chip-scale microsystems information processing capabilities in the temporal, spectral, and spatial domains. Future prospects and challenges in computing and networking applications will also be discussed.
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S. J. Ben Yoo, "Heterogeneous 2D and 3D integrated circuits for temporal, spectral, and spatial information processing", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660B (27 February 2015); doi: 10.1117/12.2085593; https://doi.org/10.1117/12.2085593
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