Heterogenous integration: the more-than-Moore path to silicon photonic microsystems

Gregory Fish; Alexander Fang

doi:10.1117/12.2084856

27 February 2015 Heterogenous integration: the more-than-Moore path to silicon photonic microsystems

Gregory Fish; Alexander Fang

Author Affiliations +

Proceedings Volume 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII; 93660H (2015) https://doi.org/10.1117/12.2084856
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

Aurion's heterogeneous integration platform combines best-in-class passive and active devices in a cost-effective manufacturing process for both military and commercial systems. The resulting silicon photonics chips can be intimately integrated with advanced electronics to enable new system-in-package capability.

Citation Download Citation

Gregory Fish, Alexander Fang, "Heterogenous integration: the more-than-Moore path to silicon photonic microsystems", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660H (27 February 2015); doi: 10.1117/12.2084856; https://doi.org/10.1117/12.2084856

ACCESS THE FULL ARTICLE

PERSONAL SIGN IN
Full access may be available with your subscription

Email or Username Forgot your username?

Password Forgot your password?

Show

Remember Email/Username on this computer

Remember Password

No SPIE account? Create an account
or Institutional Sign In via Shibboleth

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $14.40

Non-members: $18.00 ADD TO CART

Show All Keywords

Keywords/Phrases

Search In:

Publication Years