27 February 2015 Heterogenous integration: the more-than-Moore path to silicon photonic microsystems
Author Affiliations +
Abstract
Aurion's heterogeneous integration platform combines best-in-class passive and active devices in a cost-effective manufacturing process for both military and commercial systems. The resulting silicon photonics chips can be intimately integrated with advanced electronics to enable new system-in-package capability.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Gregory Fish, Alexander Fang, "Heterogenous integration: the more-than-Moore path to silicon photonic microsystems", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660H (27 February 2015); doi: 10.1117/12.2084856; https://doi.org/10.1117/12.2084856
PROCEEDINGS
3 PAGES


SHARE
RELATED CONTENT


Back to Top