Heterogenous integration: the more-than-Moore path to silicon photonic microsystems

Gregory Fish; Alexander Fang

doi:10.1117/12.2084856

27 February 2015 Heterogenous integration: the more-than-Moore path to silicon photonic microsystems

Gregory Fish; Alexander Fang

Author Affiliations +

Proceedings Volume 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII; 93660H (2015) https://doi.org/10.1117/12.2084856
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

Aurion's heterogeneous integration platform combines best-in-class passive and active devices in a cost-effective manufacturing process for both military and commercial systems. The resulting silicon photonics chips can be intimately integrated with advanced electronics to enable new system-in-package capability.

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Gregory Fish, Gregory Fish, Alexander Fang, Alexander Fang, } "Heterogenous integration: the more-than-Moore path to silicon photonic microsystems", Proc. SPIE 9366, Smart Photonic and Optoelectronic Integrated Circuits XVII, 93660H (27 February 2015); doi: 10.1117/12.2084856; https://doi.org/10.1117/12.2084856

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