Translator Disclaimer
8 February 2015 Advances in three-dimensional integration technologies in support of infrared focal plane arrays
Author Affiliations +
Staring infrared focal plane arrays (FPAs) require pixel-level, three-dimensional (3D) integration with silicon readout integrated circuits (ROICs) that provide detector bias, integrate detector current, and may further process the signals. There is an increased interest in ROIC technology as a result of two trends in the evolution of infrared FPAs. The first trend involves decreasing the FPA pixel size, which leads to the increased information content within the same FPA die size. The second trend involves the desire to enhance signal processing capability at the FPA level, which opens the door to the detector behaving like a smart peripheral rather than a passive component—with complex signal processing functions being executed on, rather than off, the FPA chip. In this paper, we review recent advances in 3D integration process technologies that support these key trends in the development of infrared FPAs. Specifically, we discuss approaches in which the infrared sensor is integrated with 3D ROIC stacks composed of multiple layers of silicon circuitry interconnected using metal-filled through-silicon vias. We describe the continued development of the 3D integration technology and summarize key demonstrations that show its viability for pixels as small as 5 microns.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. S. Temple, E. P. Vick, D. Malta, M. R. Lueck, M. R. Skokan, C. M. Masterjohn, and M. S. Muzilla "Advances in three-dimensional integration technologies in support of infrared focal plane arrays", Proc. SPIE 9370, Quantum Sensing and Nanophotonic Devices XII, 93701L (8 February 2015);


Wafer-scale integration of antimonide-based MWIR FPAs
Proceedings of SPIE (April 12 2021)
Integrated infrared detectors and readout circuits
Proceedings of SPIE (May 17 2006)
Advanced FPAs for multiple applications
Proceedings of SPIE (August 05 2002)
Performance of 320 x 240 uncooled IRFPA with SOI diode...
Proceedings of SPIE (December 15 2000)
Monolithically integrated HgCdTe focal plane arrays
Proceedings of SPIE (December 08 2003)

Back to Top