Large area LED package

L. Goullon; R. Jordan; T. Braun; J. Bauer; Karl Friedrich Becker; M. Hutter; M. Schneider-Ramelow; K.-D. Lang

doi:10.1117/12.2079380

9 March 2015 Large area LED package

L. Goullon, R. Jordan, T. Braun, J. Bauer, Karl Friedrich Becker, M. Hutter, M. Schneider-Ramelow, K.-D. Lang

Proceedings Volume 9383, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XIX; 93831A (2015) https://doi.org/10.1117/12.2079380
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

Solid state lighting using LED-dies is a rapidly growing market. LED-dies with the needed increasing luminous flux per chip area produce a lot of heat. Therefore an appropriate thermal management is required for general lighting with LEDdies. One way to avoid overheating and shorter lifetime is the use of many small LED-dies on a large area heat sink (down to 70 μm edge length), so that heat can spread into a large area while at the same time light also appears on a larger area. The handling with such small LED-dies is very difficult because they are too small to be picked with common equipment. Therefore a new concept called collective transfer bonding using a temporary carrier chip was developed. A further benefit of this new technology is the high precision assembly as well as the plane parallel assembly of the LED-dies which is necessary for wire bonding. It has been shown that hundred functional LED-dies were transferred and soldered at the same time. After the assembly a cost effective established PCB-technology was applied to produce a large-area light source consisting of many small LED-dies and electrically connected on a PCB-substrate. The top contacts of the LED-dies were realized by laminating an adhesive copper sheet followed by LDI structuring as known from PCB-via-technology. This assembly can be completed by adding converting and light forming optical elements. In summary two technologies based on standard SMD and PCB technology have been developed for panel level LED packaging up to 610x 457 mm2 area size.

Citation Download Citation

L. Goullon, R. Jordan, T. Braun, J. Bauer, Karl Friedrich Becker, M. Hutter, M. Schneider-Ramelow, and K.-D. Lang "Large area LED package", Proc. SPIE 9383, Light-Emitting Diodes: Materials, Devices, and Applications for Solid State Lighting XIX, 93831A (9 March 2015); https://doi.org/10.1117/12.2079380

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available