19 March 2015 Massively parallel E-beam inspection: enabling next-generation patterned defect inspection for wafer and mask manufacturing
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Abstract
SEMATECH aims to identify and enable disruptive technologies to meet the ever-increasing demands of semiconductor high volume manufacturing (HVM). As such, a program was initiated in 2012 focused on high-speed e-beam defect inspection as a complement, and eventual successor, to bright field optical patterned defect inspection [1]. The primary goal is to enable a new technology to overcome the key gaps that are limiting modern day inspection in the fab; primarily, throughput and sensitivity to detect ultra-small critical defects. The program specifically targets revolutionary solutions based on massively parallel e-beam technologies, as opposed to incremental improvements to existing e-beam and optical inspection platforms. Wafer inspection is the primary target, but attention is also being paid to next generation mask inspection. During the first phase of the multi-year program multiple technologies were reviewed, a down-selection was made to the top candidates, and evaluations began on proof of concept systems. A champion technology has been selected and as of late 2014 the program has begun to move into the core technology maturation phase in order to enable eventual commercialization of an HVM system. Performance data from early proof of concept systems will be shown along with roadmaps to achieving HVM performance. SEMATECH’s vision for moving from early-stage development to commercialization will be shown, including plans for development with industry leading technology providers.
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Matt Malloy, Matt Malloy, Brad Thiel, Brad Thiel, Benjamin D. Bunday, Benjamin D. Bunday, Stefan Wurm, Stefan Wurm, Maseeh Mukhtar, Maseeh Mukhtar, Kathy Quoi, Kathy Quoi, Thomas Kemen, Thomas Kemen, Dirk Zeidler, Dirk Zeidler, Anna Lena Eberle, Anna Lena Eberle, Tomasz Garbowski, Tomasz Garbowski, Gregor Dellemann, Gregor Dellemann, Jan Hendrik Peters, Jan Hendrik Peters, } "Massively parallel E-beam inspection: enabling next-generation patterned defect inspection for wafer and mask manufacturing", Proc. SPIE 9423, Alternative Lithographic Technologies VII, 942319 (19 March 2015); doi: 10.1117/12.2175535; https://doi.org/10.1117/12.2175535
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