Simulation was done for an advanced memory stack for optimal overlay target design which provides robustness for the process variation and sufficient signal for the stack. Robustness factor and sufficient signal factor sometimes contradicting each other, therefore there is trade-off between these two factors. Simulation helped to find the design to meet the requirement of both factors. The investigation involves also recipe optimization which decides the measurement conditions like wavelength. KLA-Tencor also introduced a new index which help to find an accurate measurement condition. In this investigation, we used CD-SEM to measure the overlay of device pattern after etch or decap process to check the correlation between the overlay of overlay mark and the overlay of device pattern.
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Honggoo Lee, Byongseog Lee, Sangjun Han, Myoungsoo Kim, Wontaik Kwon, Sungki Park, DongSub Choi, Dohwa Lee, Sanghuck Jeon, Kangsan Lee, Roie Volkovich, Tal Itzkovich, Eitan Herzel, Mark Wagner, Mohamed Elkodadi, "Overlay accuracy investigation for advanced memory device," Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94240C (19 March 2015);