19 March 2015 Scatterometry-based defect detection for DSA in-line process control
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Abstract
Successful implementation of directed self-assembly in high volume manufacturing is contingent upon the ability to control the new DSA-specific local defects such as “dislocations” or “line-shifts” or “fingerprint-like” defects. Conventional defect inspection tools are either limited in resolution (brightfield optical methods) or in the area / number of defects to investigate / review (SEM). Here we explore in depth a scatterometry-based technique that can bridge the gap between area throughput and detection resolution. First we establish the detection methodology for scatterometry-based defect detection, then we compare to established methodology. Careful experiments using scatterometry imaging confirm the ultimate resolution for defect detection of scatterometry-based techniques as low as <1% defect per area sampled – similar to CD-SEM based detection, while retaining a 2 orders of magnitude higher area sampling rate.
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Robin Chao, Robin Chao, Chi-Chun Liu, Chi-Chun Liu, Cornel Bozdog, Cornel Bozdog, Aron Cepler, Aron Cepler, Matthew Sendelbach, Matthew Sendelbach, Oded Cohen, Oded Cohen, Shay Wolfling, Shay Wolfling, Todd Bailey, Todd Bailey, Nelson Felix, Nelson Felix, "Scatterometry-based defect detection for DSA in-line process control", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 942419 (19 March 2015); doi: 10.1117/12.2087093; https://doi.org/10.1117/12.2087093
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