19 March 2015 Hybridization of XRF/XPS and scatterometry for Cu CMP process control
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Abstract
This paper demonstrates the synergy between X-rays techniques and scatterometry, and the benefits to combine the data to improve the accuracy and precision for in-line metrology. Particular example is given to show that the hybridization addresses the challenges of aggressive patterning. In 10nm node back-end-of-line (BEOL) integration, we show that the hybridized data between scatterometry and simultaneous X-Ray Fluorescence (XRF) and X-ray Photoelectron Spectroscopy (XPS) provided the closest dimensional correlation to TEM results compared to the individual technique and CDSEM.
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Benoit L'Herron, Benoit L'Herron, Robin Chao, Robin Chao, Kwanghoon Kim, Kwanghoon Kim, Wei Ti Lee, Wei Ti Lee, Koichi Motoyama, Koichi Motoyama, Bartlet Deprospo, Bartlet Deprospo, Theodorus Standaert, Theodorus Standaert, John Gaudiello, John Gaudiello, Cindy Goldberg, Cindy Goldberg, "Hybridization of XRF/XPS and scatterometry for Cu CMP process control", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241M (19 March 2015); doi: 10.1117/12.2086155; https://doi.org/10.1117/12.2086155
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