19 March 2015 Overlay measurement accuracy enhancement by design and algorithm
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Advanced design nodes require more complex lithography techniques, such as double patterning, as well as advanced materials like hard masks. This poses new challenge for overlay metrology and process control. In this publication several step are taken to face these challenges. Accurate overlay metrology solutions are demonstrated for advanced memory devices.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Honggoo Lee, Honggoo Lee, Byongseog Lee, Byongseog Lee, Sangjun Han, Sangjun Han, Myoungsoo Kim, Myoungsoo Kim, Wontaik Kwon, Wontaik Kwon, Sungki Park, Sungki Park, DongSub Choi, DongSub Choi, Dohwa Lee, Dohwa Lee, Sanghuck Jeon, Sanghuck Jeon, Kangsan Lee, Kangsan Lee, Tal Itzkovich, Tal Itzkovich, Nuriel Amir, Nuriel Amir, Roie Volkovich, Roie Volkovich, Eitan Herzel, Eitan Herzel, Mark Wagner, Mark Wagner, Mohamed El Kodadi, Mohamed El Kodadi, "Overlay measurement accuracy enhancement by design and algorithm", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94242B (19 March 2015); doi: 10.1117/12.2085272; https://doi.org/10.1117/12.2085272


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