Total fidelity management in self-aligned multiple patterning process

Masatoshi Yamato; Noriaki Okabe; Arisa Hara; Sakurako Natori; Shouhei Yamauchi; Kyohei Koike; Kenichi Oyama; Hidetami Yaegashi

doi:10.1117/12.2085765

20 March 2015 Total fidelity management in self-aligned multiple patterning process

Masatoshi Yamato, Noriaki Okabe, Arisa Hara, Sakurako Natori, Shouhei Yamauchi, Kyohei Koike, Kenichi Oyama, Hidetami Yaegashi

Author Affiliations +

Proceedings Volume 9425, Advances in Patterning Materials and Processes XXXII; 94250D (2015) https://doi.org/10.1117/12.2085765
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

Through the continuous scaling with extension of 193-immersion lithography, the multi-patterning process with the grid-based design has become nominal process for fine fabrication to relax tight pitch designs^[1]. In self-aligned type multiple patterning, 7 nm node gate pattern was reported^[2],[3] and it was become a focal point LER on core-pattern is essential category to control pattern placement variations. Though CD uniformity (CDU) on line pattern in self-aligned double patterning (SADP) is relatively stable caused in high thickness controllability of spacer deposition films, the variations of CDU and LER on first core pattern impinge the CDU on space and pitch pattern. In previous study, pattern fidelity of single exposure patterning was improved through photoresist smoothing process using direct-current superposition technique^[4],[5].

In this paper, we will report that photoresist smoothing work in an efficient way to pattern fidelity control in self-aligned type multiple patterning.

Citation Download Citation

Masatoshi Yamato, Masatoshi Yamato, Noriaki Okabe, Noriaki Okabe, Arisa Hara, Arisa Hara, Sakurako Natori, Sakurako Natori, Shouhei Yamauchi, Shouhei Yamauchi, Kyohei Koike, Kyohei Koike, Kenichi Oyama, Kenichi Oyama, Hidetami Yaegashi, Hidetami Yaegashi, "Total fidelity management in self-aligned multiple patterning process", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250D (20 March 2015); doi: 10.1117/12.2085765; https://doi.org/10.1117/12.2085765

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