Spin coating has been used as a photoresist application method for many years, and consequently certain defects have been recognized through each resist generation; i-line, KrF, ArF, ArF immersion and, most recently, EUV. Last year we reported an in-situ analysis via high-speed video camera that proved to be useful for understanding defect formation such as non-uniformity spots within organic film coatings and post-develop water-mark defects. In this study, fingerprints known as ‘tiger stripes’ around the wafer’s edge were analyzed. This phenomenon, for example, is directly related to the wafer spin-speed and air-flow during the coat-processing.
Utilizing a high-speed camera and 3D simulation, we reveal the mechanism of fingerprint generation for tiger stripe phenomena, confirm the mechanism with several different spin-speeds, and correlate these to defect inspection results. Furthermore, we will discuss the expansion to 450mmm wafers.