20 March 2015 Fundamental study of spin-coating using in-situ analysis and simulation
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Spin coating has been used as a photoresist application method for many years, and consequently certain defects have been recognized through each resist generation; i-line, KrF, ArF, ArF immersion and, most recently, EUV. Last year we reported an in-situ analysis via high-speed video camera that proved to be useful for understanding defect formation such as non-uniformity spots within organic film coatings and post-develop water-mark defects. In this study, fingerprints known as ‘tiger stripes’ around the wafer’s edge were analyzed. This phenomenon, for example, is directly related to the wafer spin-speed and air-flow during the coat-processing. Utilizing a high-speed camera and 3D simulation, we reveal the mechanism of fingerprint generation for tiger stripe phenomena, confirm the mechanism with several different spin-speeds, and correlate these to defect inspection results. Furthermore, we will discuss the expansion to 450mmm wafers.
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Masahiko Harumoto, Masahiko Harumoto, Jun-ichi Yoshida, Jun-ichi Yoshida, Harold Stokes, Harold Stokes, Yuji Tanaka, Yuji Tanaka, Tadashi Miyagi, Tadashi Miyagi, Koji Kaneyama, Koji Kaneyama, Charles Pieczulewski, Charles Pieczulewski, Masaya Asai, Masaya Asai, "Fundamental study of spin-coating using in-situ analysis and simulation", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250G (20 March 2015); doi: 10.1117/12.2085277; https://doi.org/10.1117/12.2085277

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