20 March 2015 Directed self-assembly of topcoat-free, integration-friendly high-x block copolymers
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To extend scaling beyond poly(styrene-b-methyl methacrylate) (PS-b-PMMA) for directed self-assembly (DSA), high quality organic high-x block copolymers (HC series) were developed and applied to implementation of sub-10 nm L/S DSA. Lamellae-forming block copolymers (BCPs) of the HC series showed the ability to form vertically oriented polymer domains conveniently with the in-house PS-r-PMMA underlayers (AZEMBLY EXP NLD series) without the use of an additional topcoat. The orientation control was achieved with low bake temperatures (≤200 °C) and short bake times (≤5 min). Also, these process-friendly materials are compatible with existing 193i-based graphoepitaxy and chemoepitaxy DSA schemes. In addition, it is notable that 8.5 nm organic lamellae domains were amenable to pattern development by simple dry etch techniques. These successful demonstrations of high-x L/S DSA on 193i-defined guiding patterns and pattern development can offer a feasible route to access sub-10 nm node patterning technology.
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Eri Hirahara, Margareta Paunescu, Orest Polishchuk, EunJeong Jeong, Edward Ng, Jianhui Shan, Jihoon Kim, SungEun Hong, Durairaj Baskaran, Guanyang Lin, Ankit Vora, Melia Tjio, Noel Arellano, Charles T. Rettner, Elizabeth Lofano, Chi-Chun Liu, Hsinyu Tsai, Anindarupa Chunder, Khanh Nguyen, Alexander M. Friz, Amy N. Bowers, Srinivasan Balakrishnan, Joy Y. Cheng, Daniel P. Sanders, "Directed self-assembly of topcoat-free, integration-friendly high-x block copolymers", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250P (20 March 2015); doi: 10.1117/12.2087398; https://doi.org/10.1117/12.2087398

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