20 March 2015 Directed self-assembly process integration: fin patterning approaches and challenges
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Directed Self Assembly (DSA) processes offer the promise of providing alternative ways to extend optical lithography cost-effectively for sub-10nm nodes and present itself as an alternative pitch division approach. As a result, DSA has gained increased momentum in recent years, as a means for extending optical lithography past its current limits. The availability of a DSA processing line can enable to further push the limits of 193nm immersion lithography and overcome some of the critical concerns for EUV lithography.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Safak Sayan, Safak Sayan, B. T. Chan, B. T. Chan, Taisir Marzook, Taisir Marzook, Nadia Vandenbroeck, Nadia Vandenbroeck, Efrain A. Sanchez, Efrain A. Sanchez, Roel Gronheid, Roel Gronheid, Arjun Singh, Arjun Singh, Paulina R. Delgadillo, Paulina R. Delgadillo, "Directed self-assembly process integration: fin patterning approaches and challenges", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250R (20 March 2015); doi: 10.1117/12.2087318; https://doi.org/10.1117/12.2087318

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