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20 March 2015 Progress in spin-on metal oxide hardmask materials for filling applications
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It is well known that metal oxide films are useful as hard mask material in semiconductor industry for their excellent etch resistance against plasma etches. In the advanced lithography processes, in addition to good etch resistance, they also need to possess good wet removability, fill capability, in high aspect ratio contacts or trenches. Conventional metal containing materials can be applied by chemical vapor deposition (CVD) or atomic layer deposition (ALD). Films derived from these techniques have difficulty in controlling wet etch, have low throughput and need special equipment. This leads to high costs. Therefore it is desirable to develop simple spin-on coating materials to generate metal oxide hard masks that have good trench or via filling performances using spin track friendly processing conditions. In this report, novel spin-on type inorganic formulations providing Ti, W, Hf and Zr oxide hard masks will be described. The new materials have demonstrated high etch selectivity, good filling performances, wet removal capability, low trace metals and good shelf-life stability. These novel AZ® Spin-on metal hard mask formulations can be used in several new applications and can potentially replace any metal, metal oxide, metal nitride or silicon-containing hard mask films currently deposited using CVD process in the semiconductor manufacturing process.
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Huirong Yao, Alberto D. Dioses, Salem Mullen, Elizabeth Wolfer, Douglas McKenzie, Dalil Rahman, JoonYeon Cho, Munirathna Padmanaban, Claire Petermann, YoungJun Her, and Yi Cao "Progress in spin-on metal oxide hardmask materials for filling applications", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 942518 (20 March 2015);


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