20 March 2015 Directly patternable dielectric based on fluorinated polyimide
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Abstract
A photosensitive polyimide system based on amine catalyzed imidization of a precursor poly(amic ester) is described. The material is based on the meta ethyl ester of pyromellitic dianhydride and 2,2’ bis(trifluoromethyl)benzidine and acts as a negative tone resist when formulated with a photobase generator. The material exhibits a dielectric constant of 3.0 in the GHz range, a coefficient of thermal expansion of 6±2 ppm/K, and can be patterned to aspect ratios of greater than 2 when formulated with a high efficiency cinnamide type photobase generator.
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Andrew R. Dick, Andrew R. Dick, William K. Bell, William K. Bell, Brendan Luke, Brendan Luke, Erin Maines, Erin Maines, Brennan Mueller, Brennan Mueller, Paul A. Kohl, Paul A. Kohl, Brandon Rawlings, Brandon Rawlings, C. Grant Willson, C. Grant Willson, } "Directly patternable dielectric based on fluorinated polyimide", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94251D (20 March 2015); doi: 10.1117/12.2085793; https://doi.org/10.1117/12.2085793
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