18 March 2015 Latest performance of ArF immersion scanner NSR-S630D for high-volume manufacturing for 7nm node
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In order to achieve stable operation in cutting-edge semiconductor manufacturing, Nikon has developed NSR-S630D with extremely accurate overlay while maintaining throughput in various conditions resembling a real production environment. In addition, NSR-S630D has been equipped with enhanced capabilities to maintain long-term overlay stability and user interface improvement all due to our newly developed application software platform. In this paper, we describe the most recent S630D performance in various conditions similar to real productions. In a production environment, superior overlay accuracy with high dose conditions and high throughput are often required; therefore, we have performed several experiments with high dose conditions to demonstrate NSR’s thermal aberration capabilities in order to achieve world class overlay performance. Furthermore, we will introduce our new software that enables long term overlay performance.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takayuki Funatsu, Takayuki Funatsu, Yusaku Uehara, Yusaku Uehara, Yujiro Hikida, Yujiro Hikida, Akira Hayakawa, Akira Hayakawa, Satoshi Ishiyama, Satoshi Ishiyama, Toru Hirayama, Toru Hirayama, Hirotaka Kono, Hirotaka Kono, Yosuke Shirata, Yosuke Shirata, Yuichi Shibazaki, Yuichi Shibazaki, "Latest performance of ArF immersion scanner NSR-S630D for high-volume manufacturing for 7nm node", Proc. SPIE 9426, Optical Microlithography XXVIII, 942617 (18 March 2015); doi: 10.1117/12.2085735; https://doi.org/10.1117/12.2085735

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