18 March 2015 Calibrating etch model with SEM contours
Author Affiliations +
Abstract
To ensure a high patterning quality, the etch effects have to be corrected within the OPC recipe in addition to the traditional lithographic effects. This requires the calibration of an accurate etch model and optimization of its implementation in the OPC flow. Using SEM contours is a promising approach to get numerous and highly reliable measurements especially for 2D structures for etch model calibration. A 28nm active layer was selected to calibrate and verify an etch model with 50 structures in total. We optimized the selection of the calibration structures as well as the model density. The implementation of the etch model to adjust the litho target layer allows a significant reduction of weak points. We also demonstrate that the etch model incorporated to the ORC recipe and run on large design can predict many hotspots.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
François Weisbuch, François Weisbuch, A. Omran, A. Omran, Kenneth Jantzen, Kenneth Jantzen, } "Calibrating etch model with SEM contours", Proc. SPIE 9426, Optical Microlithography XXVIII, 94261T (18 March 2015); doi: 10.1117/12.2180271; https://doi.org/10.1117/12.2180271
PROCEEDINGS
11 PAGES


SHARE
RELATED CONTENT

3D resist profile modeling for OPC applications
Proceedings of SPIE (April 11 2013)
Bringing SEM-contour based OPC to production
Proceedings of SPIE (March 30 2014)
Optimal structure sampling for etch model calibration
Proceedings of SPIE (March 23 2017)
Using custom features to check OPC model performance
Proceedings of SPIE (October 13 2011)

Back to Top