Plasma and Resist Interactions, including Patterning Quality Control for LER, CD Uniformity, etc.
Visit My Account to manage your email alerts.
Plasma etch challenges with new EUV lithography material introduction for patterning for MOL and BEOL
Spectral analysis of the line-width and line-edge roughness transfer during self-aligned double patterning approach
Challenges and mitigation strategies for resist trim etch in resist-mandrel based SAQP integration scheme
Finding practical phenomenological models that include both photoresist behavior and etch process effects
Low-temperature and damage-free transition metal and magnetic material etching using a new metallic complex reaction
RIE challenges for sub-15 nm line-and-space patterning using directed self-assembly lithography with coordinated line epitaxy (COOL) process
A facile route for fabricating graphene nanoribbon array transistors using graphoepitaxy of a symmetric block copolymer
Direct comparison of the performance of commonly used e-beam resists during nano-scale plasma etching of Si, SiO2, and Cr
Characterization of the effect of etch process operating environment on the perfluoroelastomer chamber seal systems