17 March 2015 DSA planarization approach to solve pattern density issue
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Directed Self-Assembly (DSA) of Block Copolymers (BCP) is one of the most promising solutions for sub-10 nm nodes. However, some challenges need to be addressed for a complete adoption of DSA in manufacturing such as achieving DSA-friendly design, low defectivity and accurate pattern placement. In this paper, we propose to discuss the DSA integration flows using graphoepitaxy for contact-hole patterning application. DSA process dependence on guiding pattern density has been studied and solved thanks to a new approach called “DSA planarization”. The capabilities of this new approach have been evaluated in terms of defectivity, Critical Dimension (CD) control and uniformity before and after DSA etching transfer.
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P. Pimenta Barros, P. Pimenta Barros, A. Gharbi, A. Gharbi, Aurélien Sarrazin, Aurélien Sarrazin, R. Tiron, R. Tiron, N. Posseme, N. Posseme, S. Barnola, S. Barnola, S. Bos, S. Bos, C. Tallaron, C. Tallaron, G. Claveau, G. Claveau, X. Chevalier, X. Chevalier, M. Argoud, M. Argoud, Isabelle Servin, Isabelle Servin, C. Navarro, C. Navarro, Célia Nicolet, Célia Nicolet, C. Lapeyre, C. Lapeyre, C. Monget, C. Monget, "DSA planarization approach to solve pattern density issue", Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV, 94280D (17 March 2015); doi: 10.1117/12.2086810; https://doi.org/10.1117/12.2086810

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