CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 9434 > Article
Open Access Paper
3 April 2015 RF to millimeter wave integration and module technologies
T. Vähä-Heikkilä
Author Affiliations +
Proceedings Volume 9434, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2015; 94340S (2015) https://doi.org/10.1117/12.2084187
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2015, San Diego, California, United States
Abstract
Radio Frequency (RF) consumer applications have boosted silicon integrated circuits (IC) and corresponding technologies. More and more functions are integrated to ICs and their performance is also increasing. However, RF front-end modules with filters and switches as well as antennas still need other way of integration. This paper focuses to RF front-end module and antenna developments as well as to the integration of millimeter wave radios. VTT Technical Research Centre of Finland has developed both Low Temperature Co-fired Ceramics (LTCC) and Integrated Passive Devices (IPD) integration platforms for RF and millimeter wave integrated modules. In addition to in-house technologies, VTT is using module and component technologies from other commercial sources.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Citation Download Citation
T. Vähä-Heikkilä "RF to millimeter wave integration and module technologies", Proc. SPIE 9434, Nanosensors, Biosensors, and Info-Tech Sensors and Systems 2015, 94340S (3 April 2015); https://doi.org/10.1117/12.2084187
PROCEEDINGS
 8 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Extremely high frequency
Antennas
Metals
Switches
Ceramics
Capacitors
Manufacturing
RELATED CONTENT
Microsystem integration from RF to millimeter wave applications
Proceedings of SPIE (June 15 2015)
3D RF integration at VTT
Proceedings of SPIE (April 09 2013)
User-friendly design approach for analog layout design
Proceedings of SPIE (March 28 2017)
Design and implementation issues for ceramic substrate micro RF relay...
Proceedings of SPIE (December 28 2005)
Micromachined systems for rf and microwave antenna applications
Proceedings of SPIE (August 16 2001)
Silicon-on-silicon microsystem in plastic packages
Proceedings of SPIE (April 01 1991)
Electronically steerable millimeter-wave antennas
Proceedings of SPIE (May 01 1994)
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top