1 April 2015 Adhesive disbond detection using piezoelectric wafer active sensors
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Abstract
The aerospace industry continues to increase the use of adhesives for structural bonding due to the increased joint efficiency (reduced weight), even distribution of the load path and decreases in stress concentrations. However, the limited techniques for verifying the strength of adhesive bonds has reduced its use on primary structures and requires an intensive inspection schedule. This paper discusses a potential structural health monitoring (SHM) technique for the detection of disbonds through the in situ inspection of adhesive joints. This is achieved through the use of piezoelectric wafer active sensors (PWAS), thin unobtrusive sensors which are permanently bonded to the aircraft structure. The detection method discussed in this study is electromechanical impedance spectroscopy (EMIS), a local vibration method. This method detects disbonds from the change in the mechanical impedance of the structure surrounding the disbond. This paper will discuss how predictive modeling can provide valuable insight into the inspection method, and provide better results than empirical methods alone. The inspection scheme was evaluated using the finite element method, and the results were verified experimentally using a large aluminum test article, and included both pristine and disbond coupons.
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William Roth, Victor Giurgiutiu, "Adhesive disbond detection using piezoelectric wafer active sensors", Proc. SPIE 9437, Structural Health Monitoring and Inspection of Advanced Materials, Aerospace, and Civil Infrastructure 2015, 94370S (1 April 2015); doi: 10.1117/12.2084414; https://doi.org/10.1117/12.2084414
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