18 December 2014 Approaches to a dies decoupling during failure analysis of the 3D package integrated circuits
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Proceedings Volume 9440, International Conference on Micro- and Nano-Electronics 2014; 94400M (2014) https://doi.org/10.1117/12.2181199
Event: The International Conference on Micro- and Nano-Electronics 2014, 2014, Zvenigorod, Russian Federation
Abstract
During failure analysis of integrated circuits (IC), it is often necessary to have opportunity to inspect surface of die. But modern IC processing technology often provide integration of number of overlaping dies in one package (3D package type). In this case upper die complicate access to low die. Thus finding techniques which provide opportunity to inspect surface of each die is actual. In present work the approaches to a die decoupling based on the exposure to fuming nitric acid (FNA) and temperature cycling of IC are considered. The experiments, carried out for 32 GB flash-drive, have shown the possibility of applying mentioned approaches to a die decoupling.
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G. Molodtsova, G. Molodtsova, R. Milovanov, R. Milovanov, D. Zubov, D. Zubov, E. Kelm, E. Kelm, } "Approaches to a dies decoupling during failure analysis of the 3D package integrated circuits", Proc. SPIE 9440, International Conference on Micro- and Nano-Electronics 2014, 94400M (18 December 2014); doi: 10.1117/12.2181199; https://doi.org/10.1117/12.2181199
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