14 February 2015 Feature extraction of probe mark image and automatic detection of probing pad defects in semiconductor using CSVM
Author Affiliations +
Proceedings Volume 9445, Seventh International Conference on Machine Vision (ICMV 2014); 94450H (2015) https://doi.org/10.1117/12.2181518
Event: Seventh International Conference on Machine Vision (ICMV 2014), 2014, Milan, Italy
Abstract
As semiconductor micro-fabrication process continues to advance, the size of probing pads also become smaller in a chip. A probe needle contacts each probing pad for electrical test. However, probe needle may incorrectly touch probing pad. Such contact failures damage probing pads and cause qualification problems. In order to detect contact failures, the current system observes the probing marks on pads. Due to a low accuracy of the system, engineers have to redundantly verify the result of the system once more, which causes low efficiency. We suggest an approach for automatic defect detection to solve these problems using image processing and CSVM. We develop significant features of probing marks to classify contact failures more correctly. We reduce 38% of the workload of engineers.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jeong-Hoon Lee, Jeong-Hoon Lee, Jee-Hyong Lee, Jee-Hyong Lee, } "Feature extraction of probe mark image and automatic detection of probing pad defects in semiconductor using CSVM", Proc. SPIE 9445, Seventh International Conference on Machine Vision (ICMV 2014), 94450H (14 February 2015); doi: 10.1117/12.2181518; https://doi.org/10.1117/12.2181518
PROCEEDINGS
6 PAGES


SHARE
Back to Top