8 January 2015 Femtosecond laser system for micromachining of the materials
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Proceedings Volume 9447, 18th International School on Quantum Electronics: Laser Physics and Applications; 94470J (2015) https://doi.org/10.1117/12.2086473
Event: Eighteenth International School on Quantum Electronics: Laser Physics and Applications, 2014, Sozopol, Bulgaria
Abstract
Femtosecond–pulse laser micromachining is based on a laser ablation phenomenon, i.e. total evaporation of material from the target surface during laser irradiation. It is the most precise method of material removal. Moreover it does not require any post processing. Removal of the material occurs only in the laser focus, since the lack of thermal interaction, neither heat affected zone (HAZ) nor debris ocur. Research results have shown that shortening the duration of the laser pulse significantly reduces HAZ, which translates into the high quality of the machined structures. It is the main argument for the use of femtosecond-pulse lasers in the precise micromachining. In this paper, a femtosecond laser system consisting of a solid-state oscillator and the ytterbium-doped pulse fiber amplifier are presented. Average beam power at 343 nm with mode-locking is 4W @25A and pulse length at the oscillator output is 500 fs. Laser micro and nano-machining has found application in different fields. It’s primary use is industrial micromachining of metals, ceramics, polymers, glass, biological material for medical use in eye surgery, and photovoltaic cells.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
R. Barbucha, M. Kocik, M. Tański, K. Garasz, T. Petrov, C. Radzewicz, "Femtosecond laser system for micromachining of the materials", Proc. SPIE 9447, 18th International School on Quantum Electronics: Laser Physics and Applications, 94470J (8 January 2015); doi: 10.1117/12.2086473; https://doi.org/10.1117/12.2086473
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