12 May 2015 Thermal resolution specification in infrared scene projectors
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Abstract
Infrared scene projectors (IRSPs) are a key part of performing dynamic testing of infrared (IR) imaging systems. Two important properties of an IRSP system are apparent temperature and thermal resolution. Infrared scene projector technology continues to progress, with several systems capable of producing high apparent temperatures currently available or under development. These systems use different emitter pixel technologies, including resistive arrays, digital micro-mirror devices (DMDs), liquid crystals and LEDs to produce dynamic infrared scenes. A common theme amongst these systems is the specification of the bit depth of the read-in integrated circuit (RIIC) or projector engine , as opposed to specifying the desired thermal resolution as a function of radiance (or apparent temperature). For IRSPs, producing an accurate simulation of a realistic scene or scenario may require simulating radiance values that range over multiple orders of magnitude. Under these conditions, the necessary resolution or “step size” at low temperature values may be much smaller than what is acceptable at very high temperature values. A single bit depth value specified at the RIIC, especially when combined with variable transfer functions between commanded input and radiance output, may not offer the best representation of a customer’s desired radiance resolution. In this paper, we discuss some of the various factors that affect thermal resolution of a scene projector system, and propose some specification guidelines regarding thermal resolution to help better define the real needs of an IR scene projector system.
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Joe LaVeigne, Joe LaVeigne, Greg Franks, Greg Franks, Tom Danielson, Tom Danielson, } "Thermal resolution specification in infrared scene projectors", Proc. SPIE 9452, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXVI, 94520Y (12 May 2015); doi: 10.1117/12.2177450; https://doi.org/10.1117/12.2177450
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