19 May 2015 Video rate passive millimeter-wave imager utilizing optical upconversion with improved size, weight, and power
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Abstract
In this presentation we will discuss the performance and limitations of our 220 channel video rate passive millimeter wave imaging system based on a distributed aperture with optical upconversion architecture. We will cover our efforts to reduce the cost, size, weight, and power (CSWaP) requirements of our next generation imager. To this end, we have developed custom integrated circuit silicon-germanium (SiGe) low noise amplifiers that have been designed to efficiently couple with our high performance lithium niobate upconversion modules. We have also developed millimeter wave packaging and components in multilayer liquid crystal polymer (LCP) substrates which greatly improve the manufacturability of the upconversion modules. These structures include antennas, substrate integrated waveguides, filters, and substrates for InP and SiGe mmW amplifiers.
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Richard D. Martin, Richard D. Martin, Shouyuan Shi, Shouyuan Shi, Yifei Zhang, Yifei Zhang, Andrew Wright, Andrew Wright, Peng Yao, Peng Yao, Kevin P. Shreve, Kevin P. Shreve, Christopher A. Schuetz, Christopher A. Schuetz, Thomas E. Dillon, Thomas E. Dillon, Daniel G. Mackrides, Daniel G. Mackrides, Charles E. Harrity, Charles E. Harrity, Dennis W. Prather, Dennis W. Prather, } "Video rate passive millimeter-wave imager utilizing optical upconversion with improved size, weight, and power", Proc. SPIE 9462, Passive and Active Millimeter-Wave Imaging XVIII, 946209 (19 May 2015); doi: 10.1117/12.2177133; https://doi.org/10.1117/12.2177133
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