13 May 2015 Residual internal stress optimization for EPON 828/DEA thermoset resin using fiber Bragg grating sensors
Author Affiliations +
Abstract
Internal residual stresses and overall mechanical properties of thermoset resins are largely dictated by the curing process. It is well understood that fiber Bragg grating (FBG) sensors can be used to evaluate temperature and cure induced strain while embedded during curing. Herein, is an extension of this work whereby we use FBGs as a probe for minimizing the internal residual stress of an unfilled and filled Epon 828/DEA resin. Variables affecting stress including cure cycle, mold (release), and adhesion promoting additives will be discussed and stress measurements from a strain gauge pop-off test will be used as comparison. Sandia National Laboratories is a multi-program laboratory managed and operated by Sandia Corporation, a wholly owned subsidiary of Lockheed Martin Corporation, for the U.S. Department of Energy’s National Nuclear Security Administration under contract DE-AC04-94AL85000.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Garth D. Rohr, Garth D. Rohr, Roger D. Rasberry, Roger D. Rasberry, Amy K. Kaczmarowski, Amy K. Kaczmarowski, Mark E. Stavig, Mark E. Stavig, Cory S. Gibson, Cory S. Gibson, Eric Udd, Eric Udd, Allen R. Roach, Allen R. Roach, Brendan Nation, Brendan Nation, } "Residual internal stress optimization for EPON 828/DEA thermoset resin using fiber Bragg grating sensors", Proc. SPIE 9480, Fiber Optic Sensors and Applications XII, 948008 (13 May 2015); doi: 10.1117/12.2179198; https://doi.org/10.1117/12.2179198
PROCEEDINGS
7 PAGES


SHARE
Back to Top