10 June 2015 Front Matter Volume 9485
This PDF file contains the front matter associated with SPIE Proceedings Volume 9485 including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.


Thermosense: Thermal Infrared Applications XXXVII

20-23 April 2015

Baltimore, Maryland, United States

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Volume 9485

Proceedings of SPIE 0277-786X, V. 9485

SPIE is an international society advancing an interdisciplinary approach to the science and application of light.

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

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Author(s), ‘Title of Paper,” in Thermosense: Thermal Infrared Applications XXXVII, edited by Sheng-Jen (Tony) Hsieh, Joseph N. Zalameda, Proceedings of SPIE Vol. 9485 (SPIE, Bellingham, WA, 2015) Article CID Number.

ISSN: 0277-786X

ISBN: 9781628416015

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Numbers in the index correspond to the last two digits of the six-digit citation identifier (CID) article numbering system used in Proceedings of SPIE. The first four digits reflect the volume number. Base 36 numbering is employed for the last two digits and indicates the order of articles within the volume. Numbers start with 00, 01, 02, 03, 04, 05, 06, 07, 08, 09, 0A, 0B…0Z, followed by 10-1Z, 20-2Z, etc.

Abouraddy, Ayman F., 0K

Akhloufi, Moulay A., 19

Ando, H., 0A

Arias, R., 14

Arion, Bogdan, 0L

Athanasakou, E., 17

Avdelidis, N. P., 04

Baldasano, Arturo, 14, 1F

Baltas, P., 17

Barizza, A., 15

Bendada, Abdelhakim, 19

Benitez-Restrepo, H. D., 12

Bison, P., 15

Bly, James B., 02

Boldrini, S., 15

Borroto, Michael, 05

Bortolin, A., 15

Bouvier, Christian, 0L

Brown, Jeff, 0B

Burke, Eric R., 02, 0S

Burleigh, D. D., 0Q

Cadelano, G., 15

Castro, G., 14

Chamberland, Martin, 1C

Chaos, M., 0H

Cheilakou, E., 04

Chen, Chien-Chon, 0M, 0O

Chen, Jian, 13

Chen, Po Chun, 0M, 0O

Chen, Shih-Hsun, 0O

Chiou, Richard Y., 1D

Chittineni, Sai Harsha, 0B

Chou, Chung-Yi, 0O

Chovit, Christopher, 05

Chulkov, A. O., 0V

Colantonio, Antonio, 07

Colla, L., 15

Contescu, Cristian I., 11

Cramer, K. Elliott, 0S

De Ketelaere, Bart, 1G

de Vries, J., 0H

Devaney, Nicholas, 0P

D’huys, Karlien, 1G

Drimbarean, Alexandru, 0P

Exarchos, D. A., 0Y

Farley, Vincent, 1C

Feng, Zhili, 13

Fernández, Carlos, 14, 1F

Ferrarini, G., 15

Florez-Ospina, Juan F., 12

Frendberg Beemer, Maria, 0R

Gagnon, Marc-André, 1C

Gallego, Nidia C., 11

Genest, Marc, 0X

Gómez, Luis, 14, 1F

González-Camino, María, 14, 1F

Gross, Kevin C, 03

Gutiérrez, Raúl, 14, 1F

Guyon, Yannis, 19

Guyot, Éric, 1C

Han, Karen, 11

Hatziioannidis, I., 04

Hawks, Michael R., 03

Horne, Michael R., 02

Howell, Patricia A., 0D, 0S

Hsieh, Sheng-Jen, 0I, 0J, 0O

Huang, Ker Jer, 0M

Hun, Chien Wan, 0M

Huot, Alexandrine, 1C

Ibarra-Castanedo, Clemente, 06, 0T, 19

Jahjah, Karl-Alexandre, 1C

Joncas, Simon, 0X

Jones, Christopher M., 05

Kamarajugadda, Pranav Ram, 1D

Kauppinen, T., 17

Kikuchi, T., 08

Kobayashi, C., 08, 0A

Korth, Hans G., 03

Koui, M., 04

Lagueux, Philippe, 1C

Lapido, Y., 14

Leando, Peter, 1I

Leduc, Catherine, 0X

Linares, Rodrigo, 14, 1F

Liu, Changchun, 1D

López, F., 06

Lynch, Colm N., 0P

Maldague, Xavier, P., 06, 0T, 0X, 12

Marcotte, Fréderick, 1C

Marini, R., 04

Marschke, Steve, 05

Matikas, T. E., 0Y

Mauk, Michael G., 1D

McIntosh, Gregory B., 07

Moghadam, Peyman, 1J

Morikawa, Junko, 0Z

Ni, Yang, 0L, 0N

Nikopoulous, B., 17

Noguier, Vincent, 0L, 0N

Nolte, Peter W., 16

Ogasawara, N., 08, 0A

Olasov, Lauren R., 11

Ospina-Borras, J. E., 12

Oswald-Tranta, B., 0C

Panouillot, P.-E., 17

Paoletti, D., 06

Psarobas, I., 0Y

Ren, N., 0H

Robitaille, Francois, 0X

Rodríguez, J., 14

Romero, Pablo, 14

Saeys, Wouter, 1G

Savary, Simon, 1C

Schmidt, R., 0C

Schweizer, Stefan, 16

Serra, Catarina, 09, 1A

Sfarra, S., 06

Shepard, Steven M., 0R

Shiryaev, V. V., 0V

Siikanen, S., 17

Simões, Inês, 1A

Simões, Nuno, 09, 1A

Singh, Bhavana, 0J

Spicer, James B., 11

Steudel, Franziska, 16

Stewart, Seán M., 1B

Tadeu, António, 09, 1A

Tao, Guangming, 0K

Theodorakeas, P., 04

Tragazikis, I., 0Y

Tremblay, Pierre, 1C

Trofimov, Vladislav V., 1H

Trofimov, Vyacheslav A., 1H

Tseng, Tzu-Liang (Bill), 1D

Varapula, Dharma T., 1D

Vavilov, V. P., 0Q, 0V

Vergara, Germán, 14, 1F

Villamayor, Víctor, 14, 1F

Wagner, Florian, 16

Wang, Hongjin, 0I, 0J

Wang, Tung R., 05

West, Lucas, 0X

Wilson, Kody A., 03

Winfree, William P., 0D, 0S

Yamada, H., 08, 0A

Yamada, S., 08

Zalameda, Joseph N., 02, 0D, 0S

Zeng, Fan W., 11

Zens, Timothy W. C., 03

Zhang, Hai, 0X

Conference Committees

Symposium Chair

  • Wolfgang Schade, Clausthal University of Technology (Germany) and Fraunhofer Heinrich-Hertz Institute (Germany)

Symposium Co-Chair

  • Ming C. Wu, University of California, Berkeley (United States)

Conference Chair

  • Sheng-Jen (Tony) Hsieh, Texas A&M University (United States)

Conference Co-Chair

  • Joseph N. Zalameda, NASA Langley Research Center (United States)

Conference Program Committee

  • Andrea Acosta, Colbert Infrared Services (United States)

  • Nicolas Avdelidis, National Technical University of Athens (Greece)

  • Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

  • Jeff R. Brown, Embry-Riddle Aeronautical University (United States)

  • Douglas Burleigh, La Jolla Cove Consulting (United States)

  • Fred P. Colbert, Colbert Infrared Services (United States)

  • K. Elliott Cramer, NASA Langley Research Center (United States)

  • Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

  • Herbert Kaplan, Honeyhill Technical Company (United States)

  • Timo T. Kauppinen, VTT Technical Research Center of Finland (Finland)

  • Dennis H. LeMieux, Siemens Power Generation, Inc. (United States)

  • Monica Lopez Saenz, IRCAM GmbH (Germany)

  • Xavier P. V. Maldague, University Laval (Canada)

  • Gary L. Orlove, FLIR Systems, Inc. (United States)

  • Beata Oswald-Tranta, Montan University Leoben (Austria)

  • G. Raymond Peacock, Temperatures.com, Inc. (United States)

  • Piotr Pregowski, Pregowski Infrared Services (Poland)

  • Ralph A. Rotolante, Vicon Enterprises Inc. (United States)

  • Andres E. Rozlosnik, SI Termograffa Infrarroja (Argentina)

  • Morteza Safai, The Boeing Company (United States)

  • Takahide Sakagami, Kobe University (Japan)

  • Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

  • Sami Siikanen, VTT Technical Research Center of Finland (Finland)

  • Gregory R. Stockton, Stockton Infrared Thermographic Services, Inc. (United States)

  • Vladimir P. Vavilov, Tomsk Polytechnic University (Russian Federation)

  • Xiong Yu, Case Western Reserve University (United States)

Session Chairs

  • 1 Aerospace Applications

    Xavier Maldague, University Laval (Canada)

    Ralph B. Dinwiddie, Oak Ridge National Laboratory (United States)

  • 2 Building Materials and Infrastructure Applications I

    Jeff R. Brown, Embry-Riddle Aeronautical University (United States)

    Beata Oswald-Tranta, Montan University Leoben (Austria)

  • 3 Building Materials and Infrastructure Applications II

    Beata Oswald-Tranta, Montan University Leoben (Austria)

    Jeff R. Brown, Embry-Riddle Aeronautical University (United States)

  • 4 Detector and Sensory System Development

    Joseph N. Zalameda, NASA Langley Research Center (United States)

    Chien-Chon Chen, National United University (Taiwan)

  • 5 NDT and Signal Processing

    Steven M. Shepard, Thermal Wave Imaging, Inc. (United States)

    Vladimir P. Vavilov, Tomsk Polytechnic University (Russian Federation)

  • 6 NDT and Materials Evaluation I

    Paolo Bison, Consiglio Nazionale delle Ricerche (Italy)

    Junko Morikawa, Tokyo Institute of Technology (Japan)

  • 7 Manufacturing and Processing Industries

    Andres E. Rozlosnik, SI Termografía Infrarroja (Argentina)

    Jian Chen, Oak Ridge National Laboratory (United States)

  • 8 NDT and Materials Evaluation II

    Takahide Sakagami, Kobe University (Japan)

    Fred P. Colbert, Colbert Infrared Services, Inc. (United States)

  • 9 Detection of Gas and Leaks

    Vladimir P. Vavilov, Tomsk Polytechnic University (Russian Federation)

    Michael Mauk, Drexel University (United States)

  • 10 Biological/Medical Applications

    Timo T. Kauppinen, VTT Technical Research Center of Finland (Finland)

    Ralph A. Rotolante, Vicon Infrared (United States)

    Award Ceremony

    Sheng-Jen Hsieh, Texas A&M University (United States)

    Joseph N. Zalameda, NASA Langley Research Center (United States)


The SPIE ThermoSense conference promotes the worldwide exchange of information about Infrared (IR) imaging technology research and applications. Relevant technology areas include: thermography, thermal infrared sensing, IR imaging, measuring instruments, and non-destructive testing methods.

ThermoSense XXXVII built upon previous successful conferences and included emerging topics in sessions on NDT and Signal Processing, Biological and Medical Applications, and Infrared Detectors and System Development. Following are brief summaries of each session.

  • Aerospace Applications: This session focused on the characterization of materials and components applied in aircraft industry using hybrid thermography, ultrasound, and/or optical imaging techniques. Topics included: coating, composites evaluation, and panel fatigue growth assessment.

  • Building Materials and Infrastructure Applications: These sessions focused on characterization of building materials and structures using thermography and analytic modeling methods such as Finite Element Analysis (FEA). Approaches utilized included lock-in, pulse-phase, and modulated frequency thermography. Types of defects investigated include flaw size, crack depth, bubbles, and pin-holes. Materials and structures studied included building concrete, storage racks, optical film, and acrylic glass.

  • Detector and Sensory System Development: This session focused on fabrication of detectors including: infrared fiber, logarithmic InGaAs, x-ray scintillator, and indium-antimony nanowires. Topics included a state-of-the-art review of infrared fiber (invited paper), infrared system integration with detectors, and computational approach to enhancing thermal imaging.

  • NDT and Signal Processing: This session consisted of four invited papers: Pulsed thermal NDT in tables, figures, and formulas [9485-26]; Advances in thermographic signal reconstruction [9485-27]; Principal component analysis for thermal image analysis [9485-28]; and Review of thermographic signal reconstruction [9485-29].

  • NDT and Materials Evaluation: These sessions focused on materials evaluation utilizing hybrid non-destructive testing methods including laser ultrasound, thermal wave, C-scan, and microscope imaging. Materials of interest included carbon fiber, photonic hetero-structure, mild steel, and nuclear graphite.

  • Manufacturing and Processing Industries: This session focused on welding processes, including spot-welding and laser beam welding process characterization.

  • Detection of Gas and Leaks: Detection of gas and leaks is an important problem for public safety and national security. The oil and gas and chemical industries have very strict guidelines on gas release. Topics presented included combustion reaction, water spray transmission, gas and flame detection, seal contamination of packaged food, and micro-fluid system activation. Both multispectral and mid-wave infrared imaging techniques were applied.

  • Biological/Medical Applications: This new session focused on applications of thermography in areas related to biology and medicine. Topics included a presentation of a 3D medical thermography device, applications of infrared imaging for mass screening, and use of thermography to track human body temperature.

The conference drew participants from many countries including: Spain, Portugal, Austria, Italy, Germany, Greece, France, Belgium, Ireland, Russia, Columbia, Chile, Belgium, Finland, Australia, Kazakhstan, Taiwan, Japan, Canada, and United States. This year, we had 46 papers and 52 presentations.

We would like to thank the authors, vendors, session chairs, ThermoSense steering committee, and SPIE technical staff who made this conference a success. Finally, we would like to acknowledge the support of Jay James, Vice President for Sales at FLIR Systems, Inc., for donating a FLIR ONE personal thermal imager as the Best Paper prize.

Sheng-Jen (Tony) Hsieh

Joseph N. Zalameda

© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
} "Front Matter Volume 9485", Proc. SPIE 9485, Thermosense: Thermal Infrared Applications XXXVII, 948501 (10 June 2015); doi: 10.1117/12.2199297; https://doi.org/10.1117/12.2199297

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