Ultraviolet nanoimprint lithography has great potential for commercial device applications that are closest to production such as optical gratings, planar waveguides, photonic crystals, semiconductor, displays, solar cell panel, sensors, highbrightness LEDs, OLEDs, and optical data storage. I report and demonstrate the newly TiO2-SiO2 ultraviolet curable materials with 20-25 wt% ratio of high titanium for CF4/O2 etch selectivity using nanoimprint lithography process. The multiple structured three-dimensional micro- and nanolines patterns were observed to be successfully patterned over the large areas. The effect of titanium concentration on CF4/O2 etch selectivity with pattern transferring carbon layer imprinting time was investigated. CF4/O2 etching rate of the TiO2-SiO2 ultraviolet curable material was approximately 3.8 times lower than that of the referenced SiO2 sol-gel ultraviolet curable material. The TiO2-SiO2 ultraviolet curable material with high titanium concentration has been proved to be versatile in advanced nanofabrication.