1 May 2015 Passive and electro-optic polymer photonics and InP electronics integration
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Abstract
Hybrid photonic integration allows individual components to be developed at their best-suited material platforms without sacrificing the overall performance. In the past few years a polymer-enabled hybrid integration platform has been established, comprising 1) EO polymers for constructing low-complexity and low-cost Mach-Zehnder modulators (MZMs) with extremely high modulation bandwidth; 2) InP components for light sources, detectors, and high-speed electronics including MUX drivers and DEMUX circuits; 3) Ceramic (AIN) RF board that links the electronic signals within the package. On this platform, advanced optoelectronic modules have been demonstrated, including serial 100 Gb/s [1] and 2x100 Gb/s [2] optical transmitters, but also 400 Gb/s optoelectronic interfaces for intra-data center networks [3]. To expand the device functionalities to an unprecedented level and at the same time improve the integration compatibility with diversified active / passive photonic components, we have added a passive polymer-based photonic board (polyboard) as the 4th material system. This passive polyboard allows for low-cost fabrication of single-mode waveguide networks, enables fast and convenient integration of various thin-film elements (TFEs) to control the light polarization, and provides efficient thermo-optic elements (TOEs) for wavelength tuning, light amplitude regulation and light-path switching.
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Z. Zhang, V. Katopodis, P. Groumas, A. Konczykowska, J. -Y. Dupuy, A. Beretta, A. Dede, E. Miller, J. H. Choi, P. Harati, F. Jorge, V. Nodjiadjim, R. Dinu, G. Cangini, A. Vannucci, D. Felipe, A. Maese-Novo, N. Keil, H. -G. Bach, Martin Schell, H. Avramopoulos, Ch. Kouloumentas, "Passive and electro-optic polymer photonics and InP electronics integration", Proc. SPIE 9516, Integrated Optics: Physics and Simulations II, 951603 (1 May 2015); doi: 10.1117/12.2179221; https://doi.org/10.1117/12.2179221
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