1 June 2015 Solderjet bumping technique used to manufacture a compact and robust green solid-state laser
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Abstract
Solder-joining using metallic solder alloys is an alternative to adhesive bonding. Laser-based soldering processes are especially well suited for the joining of optical components made of fragile and brittle materials such as glasses, ceramics and optical crystals due to a localized and minimized input of thermal energy. The Solderjet Bumping technique is used to assemble a miniaturized laser resonator in order to obtain higher robustness, wider thermal conductivity performance, higher vacuum and radiation compatibility, and better heat and long term stability compared with identical glued devices. The resulting assembled compact and robust green diode-pumped solid-state laser is part of the future Raman Laser Spectrometer designed for the Exomars European Space Agency (ESA) space mission 2018.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
P. Ribes, P. Ribes, T. Burkhardt, T. Burkhardt, M. Hornaff, M. Hornaff, S. Kousar, S. Kousar, D. Burkhardt, D. Burkhardt, E. Beckert, E. Beckert, M. Gilaberte, M. Gilaberte, D. Guilhot, D. Guilhot, D. Montes, D. Montes, M. Galan, M. Galan, S. Ferrando, S. Ferrando, M. Laudisio, M. Laudisio, T. Belenguer, T. Belenguer, S. Ibarmia, S. Ibarmia, P. Gallego, P. Gallego, J. A. Rodríguez, J. A. Rodríguez, R. Eberhardt, R. Eberhardt, A. Tünnermann, A. Tünnermann, "Solderjet bumping technique used to manufacture a compact and robust green solid-state laser", Proc. SPIE 9520, Integrated Photonics: Materials, Devices, and Applications III, 952009 (1 June 2015); doi: 10.1117/12.2178373; https://doi.org/10.1117/12.2178373
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